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A calibration technique based on fitting to measured electrical characterization data is presented, along with correlation of the electrical characteristics to direct physical strain measurements.
The limited characterization or measurement capabilities for 3-D IC stacks and a strict "good die" requirement make this type of analysis critical in order to achieve an acceptable level of functional and parametric yield.
Abstract: Of the total cost involved in producing a microelectronic component, between 50% to 90% goes towards the packaging, depending on the specific type of die and packaging technology.
Attendance to this seminar will count towards professional development hours for IEEE, ASQ. (2nd Edition)," Mike Silverman and Adam Bahret have delivered what few have done before: a comprehensive yet succinct overview of the field of reliability engineering and testing.
Please feel free to forward this message to your friends and colleagues. Engineers and engineering managers will find much in this book of immediate practical value. Jay and all the Ops Staff Pensacola Beach, FL -- The 2016 Accelerated Stress Testing and Reliability (ASTR) Conference is focused on highlighting cutting-edge methods to deliver maximum cost-benefits from reliability testing.
However, approximately 95% of the reliability issues are actually related to the packaging rather than the die.
There are a variety of surfaces and interfaces, the integrity of which needs to be maintained at all times, in order for the die to be able to function reliably over its service life.